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You can hear not more than a smooth >>click<< when the patented snap on heat sink SOHS1 contacted the housing of the semiconductor. More than 40,000 pcs. a day will be assembled by simple snap-on-tools and without the use of thermolubricant. Potentials of cost reduction in unknown dimensions are reality.
The possibility to do that is a patented >>stamp-bend-heat-sink<< which will be assembled by a manual snap-on-tool or by an assembling machine without additional fixing elements like screw or adhesive. A unique construction guarantee best conduction with the semiconductor housing (P-DSO-20-5) and gives a high security against sources of errors like vibration and shock. Without thermolubricant the SOHS1 reaches a RTH 20 K / W at normal air velocity (0,3 m / s) and, additional by the markings on the semiconductor is practicable.
The SOHS1 is used in Telecom applications at extreme conditions worldwide. So the SOHS1 can be used in a lot of applications, where the semiconductor housings P-DSO-20-5 are in use. You can get SOHS1 heat sinks, tools, application instruction, gauges and so on from Willow Technologies Limited.
For more information, please contact:
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